As the performance of smartphones improves, the importance of the cooling system is obvious. Copper vapor chamber we produce satisfies the requirements of Apple, Huawei, Samsung, with the feature of tight tolerance and flatness.

Like heat pipes, vapor chamber thermal conductivity increases with length. This means that a vapor chamber the same size as the heat source will offer little advantage over a solid piece of copper. A good rule of thumb says that the area of the vapor chamber should be equal to or greater than 10X the area of the heat source. In situations where the thermal budget is large or when a lot of airflow drives a small fin stack this may not be an issue. However, it’s often the case that the base of the sink needs to be considerably larger than the heat source.

A vapor chamber is a thin, relatively flat plate, that is used to spread heat over a wide surface area. Typically, a fin stack is applied directly to the surface of the vapor chamber to offer the maximum surface area possible for cooling via airflow.