A vapor chamber is a thin, relatively flat plate, that is used to spread heat over a wide surface area. Typically, a fin stack is applied directly to the surface of the vapor chamber to offer the maximum surface area possible for cooling via airflow.
Vapor Chambers are designed for vastly improved thermal performance over traditional solid metal heat spreaders found in traditional CPU coolers. This is accomplished while achieving a reduced weight and height. Vapor Chamber technology enables higher CPUs with a higher TDP (or overclocked state) to be efficiently and effectively cooled to safe operating temperatures, extending component and product life.
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