Laser Depaneling Machine is used for SMT industry and semiconductor industry, mainly for THE SMT industry OF FPCB, PCBA, soft and hard combined PCB board and drilling and semiconductor industry of FPCB, PCBA, soft and hard combined PCB board and drilling
LD-5 Inline Laser Depaneling Machine
● Granite platform, high precision, stability and durability;
● Linear motor drive, high speed, low noise, no vibration;
● Linear scale positioning, repetition accuracy up to ±2 μm;
● Three section on-line track, high cutting efficiency;
● Large working size range, 400*400mm;
● Green light and UV sources are optional;
● Laser line width less than 20μm;
● External purification unit.
TECHNICAL SPECIFICATIONS
|
Model No. |
LD-5 |
|
|
Laser Type |
UV/Nano Secs/15W |
GREEN LIGHT/Nano Secs/35W |
|
X/Y Distances (mm) |
690*534 |
|
|
Z Axis Distances (mm) |
100 |
|
|
Working Area (mm) |
400*400 |
|
|
Granite platform flatness (mm) |
±0.01 |
|
|
Platform Accuracy |
Positioning accuracy (μm): ±3，Repeatibilty (μm): ±2 |
|
|
Platform Speed (mm/s) |
Maximum speed 1000mm/s, acceleration 10000mm/s² |
|
|
Laser Lifespan |
＞20000 H |
|
|
Cutting Methods |
Scanning head mode, cutting range of 50*50mm |
|
|
Min. focus spot diameter |
≤20μm |
|
|
Machine Control System |
Integrated Vision, Laser Source and Movement |
|
|
Software Support |
Dxf or Gerber or common formats |
|
|
Power Consumption |
220V/50Hz/5KVA |
|
|
Operating Temperature |
15℃-35℃ |
|
|
Weight（kgs） |
1800 |
|
|
Dimensions (mm) |
1250(W) x 1400(D) x 1700(H) |
|
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