Chip components---thin film resistors and networks
I. Overview
Using semiconductor thin film vacuum evaporation, sputtering, electroplating, photolithography, laser trimming, scribing and other processes, pattern metallization on the surface of ceramic substrates (or special substrates) to achieve specific functions such as resistance, capacitance, and inductance. element.
2. Product features
High precision, high reliability, comprehensive replacement of foreign imported components
3. technical indicators
Material: SiO2/Al2O3/AlN/Si;
Accuracy: line width/line spacing accuracy ±2.5um, resistance accuracy up to ±0.01%
Metalization: Ti, Cu, Ni, Pt, Au, thin film resistors, etc.; meet the requirements of gold wire bonding, SnPb/AuSn/AuSi/AuGe welding, conductive adhesive bonding.
Others: TCR<±25ppm.
4. typical products
Typical products include: chip resistors, chip capacitors, chip inductors, pyrotechnics
5 .application areas
Aerospace, aviation, shipping, shipborne, missile-borne, medical, biological, equipment and other fields.
Precision resistance |
Resistance material |
NiCr |
Temperature Coefficient TCR(ppm/℃):±25--±5 |
Tantalum Nitride |
Temperature Coefficient TCR(ppm/℃):-100---50 |
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Substrate material |
Glass-ceramic Silicon wafer Alumina Aluminum nitride |
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Precision |
±0.1% -- ±0.02% |
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Passivation layer structure |
SiO2+Si3N4、SiO2 |
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Size |
0404、0603、0805、1206Common specifications |
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Resistance range |
10Ω—1MΩ |
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power |
25 mW –100 mW |
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Applicable temperature range |
-65℃--125℃ |
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Precision resistance The internet |
Precision |
±0.1% -- ±0.02% |
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Relative accuracy |
±0.02% |
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Temperature tracking coefficient accuracy |
±0.02%--±0.05% |
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Size |
Design according to specific drawings |
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Package form |
Chip surface mount, ceramic shell package, encapsulation package, etc. can be used according to customer needs |
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Temperature Coefficient |
±10ppm |
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Applicable temperature range |
-65℃--125℃ |
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Antistatic ability |
1500V-2000V |