Highly reliable substrate

I. Overview

Using semiconductor thin film vacuum evaporation, sputtering, electroplating, photolithography, laser trimming, scribing and other processes, pattern metallization on the surface of the ceramic substrate, while integrating resistors, capacitors, inductors, etc., to produce circuit substrates with specific functions , With electrical connection, physical support, heat dissipation and other functions, used in hybrid integrated circuit interconnect substrates, sensors, MCM, etc.

2. Product features

High reliability, customized

3.  technical indicators

lMaterial: Al2O3/AlN.

lAccuracy: line width/line spacing accuracy ±5um.

lMetalization: Ti, Ni, Pt, Au, thin film resistors, prefabricated AuSn films, etc.; meet the requirements of gold wire bonding, SnPb/AuSn/AuSi/AuGe welding, and conductive adhesive bonding.

4. application areas

Aerospace, aviation, shipbuilding, shipborne, missile-borne, civil and other fields.